ChipTest | BUs | Test Engineering

Business Units - Test Engineering



Project Feasibility Study

  • Data Sheet & Product Functionality Review and Analysis
  • Determination of Required Tests based on Product application and Electrical parameter specifications
  • Tabulation of Test methodology for each test with input / output conditions & limits, in the form of a Test Plan Matrix
  • Agreement with Customer on the derived Test Plan Matrix & Scope finalization

Hardware Design & Fabrication

  • Selection of appropriate Tester platform capable of handling the product for the agreed Test Plan Matrix
  • Design of the product hardware load board schematic and the Adaptor Board for interfacing with the DUT
  • Selection of Manual Test Socket, Handler Contactor Mechanism inclusive of the Mechanical interface design
  • Design of the probe card based on the die pad layout and suitable interface with the Tester Load Board
  • Fabrication of designed hardware modules like Load Board, Manual DUT Board, Handler Interface Board & the Probe Cards

Program Development & Debugging

  • Development of the test program code for the designed hardware schematic as per the agreed Test Plan Matrix conditions
  • Debugging of the program using the constructed hardware modules and known good products
  • Verification of test measurement data for each parameter
  • Refinement of hardware or test program depending upon the product characteristics & the observed values, for better performance
  • Test Time Optimization is considered as part of the program debugging

Product Characterization & Correlation

  • Verification & Refinement of the developed application program and set-up using Correlation Units provided by the Customer, wherever available
  • Correlation of Tester measurements with Bench parameter values in case of non-availability of known correlation units
  • Electrical Characterization of New products for various parameters & input conditions
  • Statistical Analysis of the measured values & Determination of test limits
  • Generation of Schmoo & Statistical distribution plots wherever possible for review by the Design team

General

  • Bench level Characterization of new products and Data Analysis for Statistical distribution
  • Onsite Test Engineering Support at Customer facility in their Test Equipments
  • Proto type Samples packaging through associated working partners
  • Lead Scan & Tape/Reel Finish process through associated working partners
  • Capabilities exist for BarCode Labelling & Drop Shipment to End Users

Reliability

  • Test Program Conversion from one platform to another & establish the correlation
  • Bench level Characterization of new products and Data Analysis for Statistical distribution
  • Onsite Test Engineering Support at Customer facility in their Test Equipments
  • Proto type Samples packaging through associated working partners
  • Lead Scan & Tape/Reel Finish process through associated working partners
  • Capabilities exist for BarCode Labelling & Drop Shipment to End Users