ChipTest | BUs | Test Engineering
Project Feasibility Study
- Data Sheet & Product Functionality Review and Analysis
- Determination of Required Tests based on Product application and Electrical parameter specifications
- Tabulation of Test methodology for each test with input / output conditions & limits, in the form of a Test Plan Matrix
- Agreement with Customer on the derived Test Plan Matrix & Scope finalization
Hardware Design & Fabrication
- Selection of appropriate Tester platform capable of handling the product for the agreed Test Plan Matrix
- Design of the product hardware load board schematic and the Adaptor Board for interfacing with the DUT
- Selection of Manual Test Socket, Handler Contactor Mechanism inclusive of the Mechanical interface design
- Design of the probe card based on the die pad layout and suitable interface with the Tester Load Board
- Fabrication of designed hardware modules like Load Board, Manual DUT Board, Handler Interface Board & the Probe Cards
Program Development & Debugging
- Development of the test program code for the designed hardware schematic as per the agreed Test Plan Matrix conditions
- Debugging of the program using the constructed hardware modules and known good products
- Verification of test measurement data for each parameter
- Refinement of hardware or test program depending upon the product characteristics & the observed values, for better performance
- Test Time Optimization is considered as part of the program debugging
Product Characterization & Correlation
- Verification & Refinement of the developed application program and set-up using Correlation Units provided by the Customer, wherever available
- Correlation of Tester measurements with Bench parameter values in case of
non-availability of known correlation units
- Electrical Characterization of New products for various parameters & input conditions
- Statistical Analysis of the measured values & Determination of test limits
- Generation of Schmoo & Statistical distribution plots wherever possible for review by the Design team
General
- Bench level Characterization of new products and Data Analysis for Statistical distribution
- Onsite Test Engineering Support at Customer facility in their Test Equipments
- Proto type Samples packaging through associated working partners
- Lead Scan & Tape/Reel Finish process through associated working partners
- Capabilities exist for BarCode Labelling & Drop Shipment to End Users
Reliability
- Test Program Conversion from one platform to another & establish the correlation
- Bench level Characterization of new products and Data Analysis for Statistical distribution
- Onsite Test Engineering Support at Customer facility in their Test Equipments
- Proto type Samples packaging through associated working partners
- Lead Scan & Tape/Reel Finish process through associated working partners
- Capabilities exist for BarCode Labelling & Drop Shipment to End Users